Issued Patents 2021
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171001 | Multiple patterning scheme integration with planarized cut patterning | Yongan Xu, Lawrence A. Clevenger, Yann Mignot, Cornelius Brown Peethala | 2021-11-09 |
| 11164778 | Barrier-free vertical interconnect structure | Junli Wang, Su Chen Fan, Yann Mignot, Lawrence A. Clevenger | 2021-11-02 |
| 11152298 | Metal via structure | Yann Mignot, James J. Kelly, Muthumanickam Sankarapandian, Yongan Xu, Daniel J. Vincent | 2021-10-19 |
| 11133216 | Interconnect structure | Roger A. Quon, Chih-Chao Yang | 2021-09-28 |
| 11107727 | Double metal double patterning with vias extending into dielectric | Yann Mignot | 2021-08-31 |
| 11094527 | Wet clean solutions to prevent pattern collapse | Cornelius Brown Peethala, Chih-Chao Yang, Raghuveer R. Patlolla | 2021-08-17 |
| 11087993 | Double replacement metal line patterning | Ruilong Xie, Chih-Chao Yang, Kangguo Cheng | 2021-08-10 |
| 11075161 | Large via buffer | Yann Mignot, Junli Wang, Chi-Chun Liu, Mary Claire Silvestre | 2021-07-27 |
| 11069564 | Double metal patterning | Yongan Xu, Yann Mignot, James J. Kelly, Lawrence A. Clevenger | 2021-07-20 |
| 11063126 | Metal contact isolation for semiconductor structures | Su Chen Fan, Yann Mignot, James J. Kelly | 2021-07-13 |
| 11056426 | Metallization interconnect structure formation | Yann Mignot, Hosadurga Shobha, Chih-Chao Yang | 2021-07-06 |
| 11024551 | Metal replacement vertical interconnections for buried capacitance | Lawrence A. Clevenger, Daniel James Dechene, Somnath Ghosh, Carl Radens | 2021-06-01 |
| 11004736 | Integrated circuit having a single damascene wiring network | Junli Wang, Somnath Ghosh, Chih-Chao Yang, Lawrence A. Clevenger | 2021-05-11 |
| 10971356 | Stack viabar structures | Su Chen Fan, Yann Mignot, James J. Kelly, Terence B. Hook | 2021-04-06 |
| 10937653 | Multiple patterning scheme integration with planarized cut patterning | Yongan Xu, Lawrence A. Clevenger, Yann Mignot, Cornelius Brown Peethala | 2021-03-02 |