| 11171006 |
Simultaneous plating of varying size features on semiconductor substrate |
Mukta G. Farooq |
2021-11-09 |
| 11152298 |
Metal via structure |
Yann Mignot, Muthumanickam Sankarapandian, Yongan Xu, Hsueh-Chung Chen, Daniel J. Vincent |
2021-10-19 |
| 11133457 |
Controllable formation of recessed bottom electrode contact in a memory metallization stack |
Raghuveer R. Patlolla, Chih-Chao Yang |
2021-09-28 |
| 11069564 |
Double metal patterning |
Hsueh-Chung Chen, Yongan Xu, Yann Mignot, Lawrence A. Clevenger |
2021-07-20 |
| 11063126 |
Metal contact isolation for semiconductor structures |
Su Chen Fan, Yann Mignot, Hsueh-Chung Chen |
2021-07-13 |
| 11049844 |
Semiconductor wafer having trenches with varied dimensions for multi-chip modules |
Ravi K. Bonam, Mukta G. Farooq, Dinesh Gupta, Kamal K. Sikka, Joshua M. Rubin |
2021-06-29 |
| 10978342 |
Interconnect with self-forming wrap-all-around barrier layer |
Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo +3 more |
2021-04-13 |
| 10971356 |
Stack viabar structures |
Su Chen Fan, Hsueh-Chung Chen, Yann Mignot, Terence B. Hook |
2021-04-06 |
| 10943883 |
Planar wafer level fan-out of multi-chip modules having different size chips |
Ravi K. Bonam, Mukta G. Farooq, Dinesh Gupta |
2021-03-09 |
| 10910307 |
Back end of line metallization structure |
Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang |
2021-02-02 |
| 10903116 |
Void-free metallic interconnect structures with self-formed diffusion barrier layers |
Joseph F. Maniscalco, Koichi Motoyama, Hosadurga Shobha, Chih-Chao Yang |
2021-01-26 |
| 10903161 |
Back end of line metallization structure |
Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang |
2021-01-26 |
