| 11177217 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Jon A. Casey, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more |
2021-11-16 |
| 11164791 |
Contact formation for stacked vertical transport field-effect transistors |
Heng Wu, Tenko Yamashita, Chen Zhang |
2021-11-02 |
| 11164817 |
Multi-chip package structures with discrete redistribution layers |
Kamal K. Sikka, Steven L. Wright, Lawrence A. Clevenger |
2021-11-02 |
| 11133259 |
Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network |
Arvind Kumar, Lawrence A. Clevenger, Steven L. Wright, Wiren D. Becker, Xiao Hu Liu |
2021-09-28 |
| 11114410 |
Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices |
Steven L. Wright, Lawrence A. Clevenger |
2021-09-07 |
| 11101318 |
Back-side memory element with local memory select transistor |
Arvind Kumar |
2021-08-24 |
| 11094637 |
Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers |
Steven L. Wright, Lawrence A. Clevenger |
2021-08-17 |
| 11088310 |
Through-silicon-via fabrication in planar quantum devices |
Jared Barney Hertzberg, Sami Rosenblatt, Vivekananda P. Adiga, Markus Brink, Arvind Kumar |
2021-08-10 |
| 11081542 |
Buried MIM capacitor structure with landing pads |
Alexander Reznicek, Praneet Adusumilli, Oscar van der Straten |
2021-08-03 |
| 11081424 |
Micro-fluidic channels having various critical dimensions |
Ravi K. Bonam, Kamal K. Sikka, Iqbal Rashid Saraf, Fee Li Lie |
2021-08-03 |
| 11069679 |
Reducing gate resistance in stacked vertical transport field effect transistors |
Heng Wu, Chen Zhang, Kangguo Cheng, Tenko Yamashita |
2021-07-20 |
| 11049844 |
Semiconductor wafer having trenches with varied dimensions for multi-chip modules |
Ravi K. Bonam, Mukta G. Farooq, Dinesh Gupta, James J. Kelly, Kamal K. Sikka |
2021-06-29 |
| 10991635 |
Multiple chip bridge connector |
Dale Curtis McHerron, Kamal K. Sikka, Ravi K. Bonam, Ramachandra Divakaruni, William J. Starke +1 more |
2021-04-27 |
| 10971504 |
Three-dimensional monolithic vertical transistor memory cell with unified inter-tier cross-couple |
— |
2021-04-06 |
| 10910312 |
Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devices |
Terence B. Hook |
2021-02-02 |
| 10903165 |
Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devices |
Terence B. Hook |
2021-01-26 |
| 10903307 |
Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layers |
Son V. Nguyen |
2021-01-26 |
