| 11201136 |
High bandwidth module |
Bhupender Singh, Shidong Li, Chris Muzzy, Thomas A. Wassick |
2021-12-14 |
| 11180398 |
Deionized-water cooling for electrical equipment |
Prabjit Singh, Lawrence Palmer, Levi A. Campbell |
2021-11-23 |
| 11177217 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more |
2021-11-16 |
| 11168400 |
Formation of terminal metallurgy on laminates and boards |
Brian M. Erwin, Chris Muzzy, Thomas Weiss |
2021-11-09 |
| 11164804 |
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste |
Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard, Kenneth C. Marston +1 more |
2021-11-02 |
| 11152282 |
Localized catalyst for enhanced thermal interface material heat transfer |
Kevin Drummond, Kenneth C. Marston, Chris Muzzy, Sushumna Iruvanti |
2021-10-19 |
| 11121101 |
Flip chip packaging rework |
Karen P. McLaughlin, Thomas A. Wassick, Brian W. Quinlan |
2021-09-14 |
| 11053604 |
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application |
Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2021-07-06 |
| 11043468 |
Lead-free solder joining of electronic structures |
Clement Fortin, Christopher D. Muzzy, Thomas A. Wassick |
2021-06-22 |
| 11031373 |
Spacer for die-to-die communication in an integrated circuit |
Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer |
2021-06-08 |
| 11031343 |
Fins for enhanced die communication |
Richard F. Indyk, Bhupender Singh, Jon A. Casey |
2021-06-08 |
| 11009545 |
Integrated circuit tester probe contact liner |
David M. Audette, Dennis R. Conti, Brian M. Erwin, Grant Wagner |
2021-05-18 |
| 11004614 |
Stacked capacitors for use in integrated circuit modules and the like |
Sylvain Pharand, Bhupender Singh, Brian W. Quinlan |
2021-05-11 |
| 10993324 |
Computer system with modified module socket |
Mark K. Hoffmeyer, Kevin Drummond, Chris Muzzy |
2021-04-27 |
| 10957650 |
Bridge support structure |
Karen P. McLaughlin, Brian W. Quinlan, Thomas Weiss |
2021-03-23 |
| 10955439 |
Electrochemical cleaning of test probes |
David M. Audette, Grant Wagner |
2021-03-23 |
| 10950573 |
Lead-free column interconnect |
Clement Fortin, Christopher D. Muzzy, Krishna R. Tunga, Thomas Weiss |
2021-03-16 |
| 10916507 |
Multiple chip carrier for bridge assembly |
Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer, Shidong Li |
2021-02-09 |
| 10895017 |
Prevent and remove organics from reservoir wells |
Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2021-01-19 |
| 10892249 |
Carrier and integrated memory |
Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss |
2021-01-12 |
