Issued Patents 2021
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201136 | High bandwidth module | Bhupender Singh, Shidong Li, Chris Muzzy, Thomas A. Wassick | 2021-12-14 |
| 11180398 | Deionized-water cooling for electrical equipment | Prabjit Singh, Lawrence Palmer, Levi A. Campbell | 2021-11-23 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 11168400 | Formation of terminal metallurgy on laminates and boards | Brian M. Erwin, Chris Muzzy, Thomas Weiss | 2021-11-09 |
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard, Kenneth C. Marston +1 more | 2021-11-02 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Kevin Drummond, Kenneth C. Marston, Chris Muzzy, Sushumna Iruvanti | 2021-10-19 |
| 11121101 | Flip chip packaging rework | Karen P. McLaughlin, Thomas A. Wassick, Brian W. Quinlan | 2021-09-14 |
| 11053604 | System for treating solution for use in electroplating application and method for treating solution for use in electroplating application | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2021-07-06 |
| 11043468 | Lead-free solder joining of electronic structures | Clement Fortin, Christopher D. Muzzy, Thomas A. Wassick | 2021-06-22 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-06-08 |
| 11031343 | Fins for enhanced die communication | Richard F. Indyk, Bhupender Singh, Jon A. Casey | 2021-06-08 |
| 11009545 | Integrated circuit tester probe contact liner | David M. Audette, Dennis R. Conti, Brian M. Erwin, Grant Wagner | 2021-05-18 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Sylvain Pharand, Bhupender Singh, Brian W. Quinlan | 2021-05-11 |
| 10993324 | Computer system with modified module socket | Mark K. Hoffmeyer, Kevin Drummond, Chris Muzzy | 2021-04-27 |
| 10957650 | Bridge support structure | Karen P. McLaughlin, Brian W. Quinlan, Thomas Weiss | 2021-03-23 |
| 10955439 | Electrochemical cleaning of test probes | David M. Audette, Grant Wagner | 2021-03-23 |
| 10950573 | Lead-free column interconnect | Clement Fortin, Christopher D. Muzzy, Krishna R. Tunga, Thomas Weiss | 2021-03-16 |
| 10916507 | Multiple chip carrier for bridge assembly | Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer, Shidong Li | 2021-02-09 |
| 10895017 | Prevent and remove organics from reservoir wells | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2021-01-19 |
| 10892249 | Carrier and integrated memory | Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2021-01-12 |