Steve Ostrander — 7 Patents at IBM

Issued Patents 2021

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11177217	Direct bonded heterogeneous integration packaging structures	Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more	2021-11-16	$1,912,000
11152226	Structure with controlled capillary coverage	Kevin Drummond, Thomas E. Lombardi, Stephanie Allard, Catherine Dufort	2021-10-19	$2,168,000
11031373	Spacer for die-to-die communication in an integrated circuit	Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Thomas Weiss, Mark W. Kapfhammer	2021-06-08	$4,452,000
10985129	Mitigating cracking within integrated circuit (IC) device carrier	Thomas E. Lombardi, Krishna R. Tunga, Thomas A. Wassick	2021-04-20	$5,008,000
10978313	Fixture facilitating heat sink fabrication	Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more	2021-04-13	$3,936,000
10916507	Multiple chip carrier for bridge assembly	Charles L. Arvin, Brian W. Quinlan, Thomas Weiss, Mark W. Kapfhammer, Shidong Li	2021-02-09	$3,536,000
10892233	Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers	Sushumna Iruvanti, Shidong Li, Jon A. Casey, Brian R. Sundlof	2021-01-12	$3,912,000