Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 11152226 | Structure with controlled capillary coverage | Kevin Drummond, Thomas E. Lombardi, Stephanie Allard, Catherine Dufort | 2021-10-19 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Thomas Weiss, Mark W. Kapfhammer | 2021-06-08 |
| 10985129 | Mitigating cracking within integrated circuit (IC) device carrier | Thomas E. Lombardi, Krishna R. Tunga, Thomas A. Wassick | 2021-04-20 |
| 10978313 | Fixture facilitating heat sink fabrication | Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more | 2021-04-13 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Brian W. Quinlan, Thomas Weiss, Mark W. Kapfhammer, Shidong Li | 2021-02-09 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Shidong Li, Jon A. Casey, Brian R. Sundlof | 2021-01-12 |