Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171102 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2021-11-09 |
| 11094657 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2021-08-17 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Shidong Li, Steve Ostrander, Jon A. Casey | 2021-01-12 |