Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201136 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Chris Muzzy, Thomas A. Wassick | 2021-12-14 |
| 11191155 | Tamper-respondent assembly with structural material within sealed inner compartment | Hongqing Zhang, Jay A. Bunt, Zhigang Song, Junjun Li, Guoda Lian | 2021-11-30 |
| 11121096 | Active control of electronic package warpage | Katsuyuki Sakuma | 2021-09-14 |
| 11098946 | Door-in-door having display screen assembly and refrigerator having the same | Mingyong Liu, Ning Wang, Weijian Fu, Yuan Wang, Heng Zhang | 2021-08-24 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-02-09 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Steve Ostrander, Jon A. Casey, Brian R. Sundlof | 2021-01-12 |