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High bandwidth module |
Charles L. Arvin, Bhupender Singh, Chris Muzzy, Thomas A. Wassick |
2021-12-14 |
| 11191155 |
Tamper-respondent assembly with structural material within sealed inner compartment |
Hongqing Zhang, Jay A. Bunt, Zhigang Song, Junjun Li, Guoda Lian |
2021-11-30 |
| 11121096 |
Active control of electronic package warpage |
Katsuyuki Sakuma |
2021-09-14 |
| 11098946 |
Door-in-door having display screen assembly and refrigerator having the same |
Mingyong Liu, Ning Wang, Weijian Fu, Yuan Wang, Heng Zhang |
2021-08-24 |
| 10916507 |
Multiple chip carrier for bridge assembly |
Charles L. Arvin, Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer |
2021-02-09 |
| 10892233 |
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers |
Sushumna Iruvanti, Steve Ostrander, Jon A. Casey, Brian R. Sundlof |
2021-01-12 |
