Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11211262 | Electronic apparatus having inter-chip stiffener | Tuhin Sinha, Steven P. Ostrander, Sylvain Ouimet | 2021-12-28 | $7,175,000 |
| 11201136 | High bandwidth module | Charles L. Arvin, Shidong Li, Chris Muzzy, Thomas A. Wassick | 2021-12-14 | $4,192,000 |
| 11195576 | Robust adaptive method and circuit for controlling a timing window for enabling operation of sense amplifier | Shishir Kumar | 2021-12-07 | $38,706,000 |
| 11031343 | Fins for enhanced die communication | Charles L. Arvin, Richard F. Indyk, Jon A. Casey | 2021-06-08 | $4,452,000 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-06-08 | $4,452,000 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Charles L. Arvin, Sylvain Pharand, Brian W. Quinlan | 2021-05-11 | $6,417,000 |