Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201136 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Shidong Li, Chris Muzzy | 2021-12-14 |
| 11121101 | Flip chip packaging rework | Charles L. Arvin, Karen P. McLaughlin, Brian W. Quinlan | 2021-09-14 |
| 11043468 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy | 2021-06-22 |
| 10985129 | Mitigating cracking within integrated circuit (IC) device carrier | Thomas E. Lombardi, Steve Ostrander, Krishna R. Tunga | 2021-04-20 |