Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201136 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Shidong Li, Thomas A. Wassick | 2021-12-14 |
| 11168400 | Formation of terminal metallurgy on laminates and boards | Charles L. Arvin, Brian M. Erwin, Thomas Weiss | 2021-11-09 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Charles L. Arvin, Kevin Drummond, Kenneth C. Marston, Sushumna Iruvanti | 2021-10-19 |
| 10993324 | Computer system with modified module socket | Charles L. Arvin, Mark K. Hoffmeyer, Kevin Drummond | 2021-04-27 |