Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158562 | Conformal integrated circuit (IC) device package lid | David J. Lewison, Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz | 2021-10-26 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Charles L. Arvin, Kevin Drummond, Kenneth C. Marston, Chris Muzzy | 2021-10-19 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Shidong Li, Steve Ostrander, Jon A. Casey, Brian R. Sundlof | 2021-01-12 |