Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11191155 | Tamper-respondent assembly with structural material within sealed inner compartment | Hongqing Zhang, Shidong Li, Zhigang Song, Junjun Li, Guoda Lian | 2021-11-30 |
| 11156409 | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | Hongqing Zhang, David J. Lewison, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey A. Zitz | 2021-10-26 |
| 11158562 | Conformal integrated circuit (IC) device package lid | David J. Lewison, Hongqing Zhang, Jeffrey A. Zitz, Sushumna Iruvanti | 2021-10-26 |