Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11156409 | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | Hongqing Zhang, Jay A. Bunt, David J. Lewison, Joyce E. Molinelli Acocella, Frank L. Pompeo | 2021-10-26 |
| 11158562 | Conformal integrated circuit (IC) device package lid | David J. Lewison, Hongqing Zhang, Jay A. Bunt, Sushumna Iruvanti | 2021-10-26 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy | 2021-04-13 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner | 2021-01-26 |
| 10892170 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Hilton T. Toy | 2021-01-12 |