Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11173486 | Fluidic cavities for on-chip layering and sealing of separation arrays | Joshua T. Smith, Benjamin H. Wunsch | 2021-11-16 |
| 11103867 | Localized surface modification for microfluidic applications | Minhua Lu, Mareva B. Fevre, James L. Hedrick, Vince Siu, Myron Plugge | 2021-08-31 |
| 11039765 | Smart pellet for sample testing | Vince Siu, Minhua Lu, Russell A. Budd, John U. Knickerbocker | 2021-06-22 |
| 11022559 | Analysis using optical sensors and signal enhancing agents | Russell A. Budd, Minhua Lu, Vince Siu | 2021-06-01 |
| 10892170 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Yi Pan, Hilton T. Toy, Jeffrey A. Zitz | 2021-01-12 |