Issued Patents 2021
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201138 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, Li-Wen Hung, Jae-Woong Nah | 2021-12-14 |
| 11171374 | Thin film solid-state microbattery packaging | Qianwen Chen, Bing Dang, Bo Wen | 2021-11-09 |
| 11169399 | Saccade and vergence tracking for distance auto focus adjustment | Emily R. Kinser, Roy R. Yu | 2021-11-09 |
| 11121005 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2021-09-14 |
| 11101513 | Thin film battery packaging | Qianwen Chen, Bing Dang, Bo Wen, Marlon Agno | 2021-08-24 |
| 11094407 | Electronics miniaturization platform for medication verification and tracking | Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Jeffrey D. Gelorme, Rajeev Narayanan +1 more | 2021-08-17 |
| 11055459 | Heterogeneous miniaturization platform | Qianwen Chen, Li-Wen Hung, Wanki Kim, Kenneth P. Rodbell, Robert L. Wisnieff | 2021-07-06 |
| 11049841 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, Mario J. Interrante, Son K. Tran | 2021-06-29 |
| 11039765 | Smart pellet for sample testing | Vince Siu, Minhua Lu, Evan G. Colgan, Russell A. Budd | 2021-06-22 |
| 11000474 | Microchip substance delivery devices | S. Jay Chey, Bing Dang, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more | 2021-05-11 |
| 10998217 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, Jeffrey D. Gelorme | 2021-05-04 |
| 10964925 | Hermetial via seal for thin film battery | Bing Dang, Qianwen Chen, Yu Luo, Jae-Woong Nah, Kai Liu +4 more | 2021-03-30 |
| 10940265 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2021-03-09 |
| 10903153 | Thinned die stack | Bing Dang, Raymond R. Horton, Joana Sofia Branquinho Teresa Maria | 2021-01-26 |
| 10892643 | Facilitation of charge of and communication with an electronic device | Bing Dang, Duixian Liu, Jean-Olivier Plouchart | 2021-01-12 |