Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11049841 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, John U. Knickerbocker, Son K. Tran | 2021-06-29 | $5,149,000 |
| 10903187 | Selective area heating for 3D chip stack | Katsuyuki Sakuma | 2021-01-26 | $1,788,000 |