Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11049841 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, Mario J. Interrante, John U. Knickerbocker | 2021-06-29 | $5,149,000 |