WB

William E. Bernier

IBM: 1 patents #5,274 of 11,638Top 50%
📍 Endwell, NY: #2 of 13 inventorsTop 20%
🗺 New York: #4,600 of 12,766 inventorsTop 40%
Overall (2021): #213,798 of 548,734Top 40%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11049841 Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection Bing Dang, Mario J. Interrante, John U. Knickerbocker, Son K. Tran 2021-06-29