MI

Marcus E. Interrante

IBM: 2 patents #3,096 of 11,638Top 30%
Overall (2021): #134,896 of 548,734Top 25%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11164804 Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste Charles L. Arvin, Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard +1 more 2021-11-02
10978314 Multi integrated circuit chip carrier package Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz 2021-04-13