Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11211262 | Electronic apparatus having inter-chip stiffener | Steven P. Ostrander, Bhupender Singh, Sylvain Ouimet | 2021-12-28 | $7,175,000 |
| 11133268 | Crack bifurcation in back-end-of-line | Naftali E. Lustig | 2021-09-28 | $6,479,000 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2021-04-13 | $3,936,000 |
| 10957622 | Spatially localized thermal interface materials | Jonathan Fry, Michael Rizzolo | 2021-03-23 | $2,115,000 |
| 10901030 | Viscoelastic pad upon integrated circuit device contact for multipass electrical characterization probe testing | Max S. Cioban, Jonathan Fry, Michael Rizzolo | 2021-01-26 | $1,788,000 |
| 10903184 | Filler particle position and density manipulation with applications in thermal interface materials | Jonathan Fry, Michael Rizzolo, Bassem M. Hamieh | 2021-01-26 | $1,788,000 |