BH

Bassem M. Hamieh

IBM: 4 patents #1,501 of 11,638Top 15%
Overall (2021): #53,611 of 548,734Top 10%
4
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11192101 Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials Chi-Chun Liu, Yann Mignot, Joshua T. Smith, Nelson Felix, Robert L. Bruce 2021-12-07
11084032 Method to create multilayer microfluidic chips using spin-on carbon as gap fill and spin-on glass tone inversion Chi-Chun Liu, Yann Mignot, Joshua T. Smith, Nelson Felix, Robert L. Bruce 2021-08-10
11067895 Method and structures for personalizing lithography John Bradley Deforge, Terence B. Hook, Theresa A. Newton, Kirk D. Peterson 2021-07-20
10903184 Filler particle position and density manipulation with applications in thermal interface materials Jonathan Fry, Tuhin Sinha, Michael Rizzolo 2021-01-26