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Back-end-of-line compatible processing for forming an array of pillars |
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Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials |
Chi-Chun Liu, Joshua T. Smith, Bassem M. Hamieh, Nelson Felix, Robert L. Bruce |
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Multiple patterning scheme integration with planarized cut patterning |
Hsueh-Chung Chen, Yongan Xu, Lawrence A. Clevenger, Cornelius Brown Peethala |
2021-11-09 |
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Barrier-free vertical interconnect structure |
Junli Wang, Hsueh-Chung Chen, Su Chen Fan, Lawrence A. Clevenger |
2021-11-02 |
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Metal via structure |
James J. Kelly, Muthumanickam Sankarapandian, Yongan Xu, Hsueh-Chung Chen, Daniel J. Vincent |
2021-10-19 |
| 11131919 |
Extreme ultraviolet (EUV) mask stack processing |
Yongan Xu, Zhenxing Bi, Nelson Felix, Ekmini Anuja De Silva |
2021-09-28 |
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Double metal double patterning with vias extending into dielectric |
Hsueh-Chung Chen |
2021-08-31 |
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Tall trenches for via chamferless and self forming barrier |
Chih-Chao Yang, Hosadurga Shobha |
2021-08-24 |
| 11084032 |
Method to create multilayer microfluidic chips using spin-on carbon as gap fill and spin-on glass tone inversion |
Chi-Chun Liu, Joshua T. Smith, Bassem M. Hamieh, Nelson Felix, Robert L. Bruce |
2021-08-10 |
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Double metal patterning |
Hsueh-Chung Chen, Yongan Xu, James J. Kelly, Lawrence A. Clevenger |
2021-07-20 |
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Metal contact isolation for semiconductor structures |
Su Chen Fan, Hsueh-Chung Chen, James J. Kelly |
2021-07-13 |
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Metallization interconnect structure formation |
Hosadurga Shobha, Hsueh-Chung Chen, Chih-Chao Yang |
2021-07-06 |
| 11037822 |
Svia using a single damascene interconnect |
Muthumanickam Sankarapandian, Yongan Xu, Joe Lee |
2021-06-15 |
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EUV pattern transfer with ion implantation and reduced impact of resist residue |
Yongan Xu, Oleg Gluschenkov |
2021-06-08 |
| 10985025 |
Fin cut profile using fin base liner |
Eric R. Miller, Stuart A. Sieg, Indira Seshadri, Christopher J. Waskiewicz |
2021-04-20 |
| 10971356 |
Stack viabar structures |
Su Chen Fan, Hsueh-Chung Chen, James J. Kelly, Terence B. Hook |
2021-04-06 |
| 10957552 |
Extreme ultraviolet lithography patterning with directional deposition |
Yongan Xu, Ekmini Anuja De Silva, Su Chen Fan |
2021-03-23 |
| 10937653 |
Multiple patterning scheme integration with planarized cut patterning |
Hsueh-Chung Chen, Yongan Xu, Lawrence A. Clevenger, Cornelius Brown Peethala |
2021-03-02 |
| 10930504 |
Selective gas etching for self-aligned pattern transfer |
John C. Arnold, Sean D. Burns, Yongan Xu |
2021-02-23 |
| 10923401 |
Gate cut critical dimension shrink and active gate defect healing using selective deposition |
Andrew M. Greene, Marc A. Bergendahl, Ekmini Anuja De Silva, Alex Joseph Varghese, Matthew T. Shoudy +2 more |
2021-02-16 |
| 10903111 |
Semiconductor device with linerless contacts |
Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more |
2021-01-26 |
| 10886197 |
Controlling via critical dimension with a titanium nitride hard mask |
Muthumanickam Sankarapandian, Yongan Xu |
2021-01-05 |
