Issued Patents 2021
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195995 | Back-end-of-line compatible processing for forming an array of pillars | Chi-Chun Liu, Ekmini Anuja De Silva, Nelson Felix, John C. Arnold | 2021-12-07 |
| 11192101 | Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials | Chi-Chun Liu, Joshua T. Smith, Bassem M. Hamieh, Nelson Felix, Robert L. Bruce | 2021-12-07 |
| 11171001 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Yongan Xu, Lawrence A. Clevenger, Cornelius Brown Peethala | 2021-11-09 |
| 11164778 | Barrier-free vertical interconnect structure | Junli Wang, Hsueh-Chung Chen, Su Chen Fan, Lawrence A. Clevenger | 2021-11-02 |
| 11152298 | Metal via structure | James J. Kelly, Muthumanickam Sankarapandian, Yongan Xu, Hsueh-Chung Chen, Daniel J. Vincent | 2021-10-19 |
| 11131919 | Extreme ultraviolet (EUV) mask stack processing | Yongan Xu, Zhenxing Bi, Nelson Felix, Ekmini Anuja De Silva | 2021-09-28 |
| 11107727 | Double metal double patterning with vias extending into dielectric | Hsueh-Chung Chen | 2021-08-31 |
| 11101175 | Tall trenches for via chamferless and self forming barrier | Chih-Chao Yang, Hosadurga Shobha | 2021-08-24 |
| 11084032 | Method to create multilayer microfluidic chips using spin-on carbon as gap fill and spin-on glass tone inversion | Chi-Chun Liu, Joshua T. Smith, Bassem M. Hamieh, Nelson Felix, Robert L. Bruce | 2021-08-10 |
| 11069564 | Double metal patterning | Hsueh-Chung Chen, Yongan Xu, James J. Kelly, Lawrence A. Clevenger | 2021-07-20 |
| 11063126 | Metal contact isolation for semiconductor structures | Su Chen Fan, Hsueh-Chung Chen, James J. Kelly | 2021-07-13 |
| 11056426 | Metallization interconnect structure formation | Hosadurga Shobha, Hsueh-Chung Chen, Chih-Chao Yang | 2021-07-06 |
| 11037822 | Svia using a single damascene interconnect | Muthumanickam Sankarapandian, Yongan Xu, Joe Lee | 2021-06-15 |
| 11031246 | EUV pattern transfer with ion implantation and reduced impact of resist residue | Yongan Xu, Oleg Gluschenkov | 2021-06-08 |
| 10985025 | Fin cut profile using fin base liner | Eric R. Miller, Stuart A. Sieg, Indira Seshadri, Christopher J. Waskiewicz | 2021-04-20 |
| 10971356 | Stack viabar structures | Su Chen Fan, Hsueh-Chung Chen, James J. Kelly, Terence B. Hook | 2021-04-06 |
| 10957552 | Extreme ultraviolet lithography patterning with directional deposition | Yongan Xu, Ekmini Anuja De Silva, Su Chen Fan | 2021-03-23 |
| 10937653 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Yongan Xu, Lawrence A. Clevenger, Cornelius Brown Peethala | 2021-03-02 |
| 10930504 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yongan Xu | 2021-02-23 |
| 10923401 | Gate cut critical dimension shrink and active gate defect healing using selective deposition | Andrew M. Greene, Marc A. Bergendahl, Ekmini Anuja De Silva, Alex Joseph Varghese, Matthew T. Shoudy +2 more | 2021-02-16 |
| 10903111 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more | 2021-01-26 |
| 10886197 | Controlling via critical dimension with a titanium nitride hard mask | Muthumanickam Sankarapandian, Yongan Xu | 2021-01-05 |