Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164815 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha | 2021-11-02 |
| 11037822 | Svia using a single damascene interconnect | Yann Mignot, Muthumanickam Sankarapandian, Yongan Xu | 2021-06-15 |
| 10985056 | Structure and method to improve FAV RIE process margin and Electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2021-04-20 |
| 10957584 | Structure and method to improve FAV RIE process margin and electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2021-03-23 |