| 11195995 |
Back-end-of-line compatible processing for forming an array of pillars |
Chi-Chun Liu, Yann Mignot, Ekmini Anuja De Silva, Nelson Felix |
2021-12-07 |
| 11189527 |
Self-aligned top vias over metal lines formed by a damascene process |
Timothy Mathew Philip, Sagarika Mukesh, Dominik Metzler, Ashim Dutta |
2021-11-30 |
| 11189783 |
Embedded MRAM device formation with self-aligned dielectric cap |
Dominik Metzler, Ashim Dutta, Donald F. Canaperi |
2021-11-30 |
| 11189561 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric |
Ashim Dutta, Ekmini Anuja De Silva, Dominik Metzler |
2021-11-30 |
| 11189528 |
Subtractive RIE interconnect |
Balasubramanian S. Pranatharthi Haran, Takeshi Nogami |
2021-11-30 |
| 11171002 |
Alternating hardmasks for tight-pitch line formation |
Anuja E. DeSilva, Nelson Felix, Chi-Chun Liu, Yann Mignot, Stuart A. Sieg |
2021-11-09 |
| 11158786 |
MRAM device formation with controlled ion beam etch of MTJ |
Ashim Dutta, Chih-Chao Yang, Lijuan Zou |
2021-10-26 |
| 11152261 |
Self-aligned top via formation at line ends |
Ashim Dutta, Dominik Metzler |
2021-10-19 |
| 11133260 |
Self-aligned top via |
Chi-Chun Liu, Dominik Metzler, Nelson Felix, Ashim Dutta |
2021-09-28 |
| 10957850 |
Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication |
Ashim Dutta, Isabel Cristina Chu, Son V. Nguyen, Michael Rizzolo |
2021-03-23 |
| 10930504 |
Selective gas etching for self-aligned pattern transfer |
Sean D. Burns, Yann Mignot, Yongan Xu |
2021-02-23 |
