Issued Patents 2021
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11199778 | Polymer brush adhesion promoter with UV cleavable linker | Jing Guo, Bharat Kumar, Ekmini Anuja De Silva, Jennifer Church, Dario L. Goldfarb | 2021-12-14 |
| 11195995 | Back-end-of-line compatible processing for forming an array of pillars | Chi-Chun Liu, Yann Mignot, Ekmini Anuja De Silva, John C. Arnold | 2021-12-07 |
| 11192101 | Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials | Chi-Chun Liu, Yann Mignot, Joshua T. Smith, Bassem M. Hamieh, Robert L. Bruce | 2021-12-07 |
| 11177130 | Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography | Ekmini Anuja De Silva, Dario L. Goldfarb, Daniel A. Corliss, Rudy J. Wojtecki | 2021-11-16 |
| 11171002 | Alternating hardmasks for tight-pitch line formation | John C. Arnold, Anuja E. DeSilva, Chi-Chun Liu, Yann Mignot, Stuart A. Sieg | 2021-11-09 |
| 11164772 | Spacer-defined process for lithography-etch double patterning for interconnects | Ekmini Anuja De Silva, Luciana Meli Thompson, Yann Mignot | 2021-11-02 |
| 11131919 | Extreme ultraviolet (EUV) mask stack processing | Yongan Xu, Zhenxing Bi, Yann Mignot, Ekmini Anuja De Silva | 2021-09-28 |
| 11133195 | Inverse tone pillar printing method using polymer brush grafts | Ekmini Anuja De Silva, Praveen Joseph, Ashim Dutta | 2021-09-28 |
| 11133260 | Self-aligned top via | Chi-Chun Liu, John C. Arnold, Dominik Metzler, Ashim Dutta | 2021-09-28 |
| 11121024 | Tunable hardmask for overlayer metrology contrast | Ekmini Anuja De Silva, Indira Seshadri, Stuart A. Sieg | 2021-09-14 |
| 11084032 | Method to create multilayer microfluidic chips using spin-on carbon as gap fill and spin-on glass tone inversion | Chi-Chun Liu, Yann Mignot, Joshua T. Smith, Bassem M. Hamieh, Robert L. Bruce | 2021-08-10 |
| 11067896 | Dynamic adjustment of post exposure bake during lithography utilizing real-time feedback for wafer exposure delay | Cody J. Murray, Ekmini Anuja De Silva, Alex Richard Hubbard, Karen E. Petrillo | 2021-07-20 |
| 11054250 | Multi-channel overlay metrology | Gangadhara Raja Muthinti, Chiew-Seng Koay, Siva Kanakasabapathy | 2021-07-06 |
| 11037786 | Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography | Ekmini Anuja De Silva, Dario L. Goldfarb, Daniel A. Corliss, Rudy J. Wojtecki | 2021-06-15 |
| 11031248 | Alternating hardmasks for tight-pitch line formation | Sean D. Burns, Chi-Chun Liu, Yann Mignot, Stuart A. Sieg | 2021-06-08 |
| 11018007 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2021-05-25 |
| 10998192 | Sequential infiltration synthesis extreme ultraviolet single expose patterning | Ekmini Anuja De Silva, Jing Guo, Luciana Meli | 2021-05-04 |
| 10950440 | Patterning directly on an amorphous silicon hardmask | Abraham Arceo de la Pena, Ekmini Anuja De Silva | 2021-03-16 |