Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101172 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Cornelius Brown Peethala, Lawrence A. Clevenger | 2021-08-24 |
| 11054250 | Multi-channel overlay metrology | Chiew-Seng Koay, Siva Kanakasabapathy, Nelson Felix | 2021-07-06 |
| 10985076 | Single metallization scheme for gate, source, and drain contact integration | Andrew M. Greene, Victor Chan | 2021-04-20 |
| 10957646 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui +2 more | 2021-03-23 |
| 10943990 | Gate contact over active enabled by alternative spacer scheme and claw-shaped cap | Andrew M. Greene, Victor Chan, Veeraraghavan S. Basker, Junli Wang, Kisik Choi +1 more | 2021-03-09 |
| 10923401 | Gate cut critical dimension shrink and active gate defect healing using selective deposition | Andrew M. Greene, Marc A. Bergendahl, Ekmini Anuja De Silva, Alex Joseph Varghese, Yann Mignot +2 more | 2021-02-16 |
| 10903111 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more | 2021-01-26 |