Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Charles L. Arvin, Kevin Drummond, Luca Del Carro, Stephanie Allard, Kenneth C. Marston +1 more | 2021-11-02 |
| 11158450 | Particle-based, anisotropic composite materials for magnetic cores | Arvind Raj Mahankali Sridhar, Suiying Ye, Luca Del Carro, Jens Oliver Ammann | 2021-10-26 |
| 11096290 | Printed circuit board with edge soldering for high-density packages and assemblies | Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Joerg-Eric Sagmeister, Patricia M. Sagmeister +1 more | 2021-08-17 |
| 10882145 | Adsorption heat exchanger devices | Javier V. Goicochea, Bruno Michel, Patrick Ruch | 2021-01-05 |
| 10886254 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Gerd Schlottig | 2021-01-05 |