Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Charles L. Arvin, Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard +1 more | 2021-11-02 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Charles L. Arvin, Kevin Drummond, Chris Muzzy, Sushumna Iruvanti | 2021-10-19 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2021-01-26 |