Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11096290 | Printed circuit board with edge soldering for high-density packages and assemblies | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Patricia M. Sagmeister +1 more | 2021-08-17 |