Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183725 | Low-profile battery construct with engineered interfaces | Paul A. Lauro, Jae-Woong Nah, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2021-11-23 |
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Kamal K. Sikka, Yang Liu, Pascale Gagnon, Christian Bergeron, Maryse Cournoyer | 2021-10-05 |
| 11127715 | Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same | Mark D. Schultz, Cornelia K. Tsang | 2021-09-21 |
| 11121005 | Handler bonding and debonding for semiconductor dies | Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2021-09-14 |
| 11043690 | Sandwich-parallel micro-battery | Jae-Woong Nah, Eric P. Lewandowski, Bucknell C. Webb, Adinath S. Narasgond, Bo Wen | 2021-06-22 |