Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11209598 | Photonics package with face-to-face bonding | Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Sylvain Pharand, Roxan Lemire +2 more | 2021-12-28 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Kamal K. Sikka, Paul S. Andry, Yang Liu, Pascale Gagnon, Christian Bergeron | 2021-10-05 |
| 10991635 | Multiple chip bridge connector | Dale Curtis McHerron, Kamal K. Sikka, Joshua M. Rubin, Ravi K. Bonam, Ramachandra Divakaruni +1 more | 2021-04-27 |