Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Kamal K. Sikka, Paul S. Andry, Yang Liu, Pascale Gagnon, Maryse Cournoyer | 2021-10-05 |
CB
Christian Bergeron
Overall (2021): #504,983 of 548,734Top 95%
1
Patents 2021