Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Kamal K. Sikka, Paul S. Andry, Yang Liu, Christian Bergeron, Maryse Cournoyer | 2021-10-05 |
PG
Pascale Gagnon
Overall (2021): #309,244 of 548,734Top 60%
1
Patents 2021