Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11209598 | Photonics package with face-to-face bonding | Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Roxan Lemire +2 more | 2021-12-28 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Charles L. Arvin, Bhupender Singh, Brian W. Quinlan | 2021-05-11 |