Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more | 2021-11-16 |
| 11031343 | Fins for enhanced die communication | Charles L. Arvin, Richard F. Indyk, Bhupender Singh | 2021-06-08 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Shidong Li, Steve Ostrander, Brian R. Sundlof | 2021-01-12 |