Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031343 | Fins for enhanced die communication | Charles L. Arvin, Bhupender Singh, Jon A. Casey | 2021-06-08 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Bhupender Singh, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-06-08 |