Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201102 | Module lid with embedded two-phase cooling and insulating layer | Pritish R. Parida, Timothy J. Chainer | 2021-12-14 |
| 11158565 | Compliant pin fin heat sink and methods | John P. Karidis | 2021-10-26 |
| 11131506 | Burst resistant thin wall heat sink | Paul W. Coteus, Shawn A. Hall, Todd E. Takken, Shurong Tian | 2021-09-28 |
| 11127715 | Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same | Paul S. Andry, Cornelia K. Tsang | 2021-09-21 |
| 11013152 | Data center coolant switch | Madhusudan K. Iyengar, Pritish R. Parida | 2021-05-18 |
| 11009926 | System level model for pumped two-phase cooling systems | Timothy J. Chainer, Leitao Chen, Pritish R. Parida, Fanghao Yang | 2021-05-18 |
| 10991639 | Compliant Pin Fin heat sink with base integral pins | — | 2021-04-27 |
| 10937671 | Conductive heat spreader and heat sink assembly for optical devices | Fuad E. Doany | 2021-03-02 |