Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127715 | Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same | Paul S. Andry, Mark D. Schultz | 2021-09-21 |
CT
Cornelia K. Tsang
Overall (2021): #489,989 of 548,734Top 90%
1
Patents 2021