Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195799 | Hybrid readout package for quantum multichip bonding | Dongbing Shao, Nicholas Torleiv Bronn, Markus Brink | 2021-12-07 |
| 11165010 | Cold-welded flip chip interconnect structure | Jae-Woong Nah, Nicholas Torleiv Bronn | 2021-11-02 |
| 11158781 | Permanent wafer handlers with through silicon vias for thermalization and qubit modification | Jae-Woong Nah, Li-Wen Hung, Adinath S. Narasgond | 2021-10-26 |
| 11043690 | Sandwich-parallel micro-battery | Jae-Woong Nah, Paul S. Andry, Bucknell C. Webb, Adinath S. Narasgond, Bo Wen | 2021-06-22 |
| 10937735 | Hybrid under-bump metallization component | Jae-Woong Nah, Adinath S. Narasgond | 2021-03-02 |
| 10881788 | Delivery device including reactive material for programmable discrete delivery of a substance | Bing Dang, Gregory M. Fritz, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2021-01-05 |