Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205035 | Bump connection placement in quantum devices in a flip chip configuration | Dongbing Shao | 2021-12-21 |
| 11195982 | Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices | Dongbing Shao, Firat Solgun, Jared Barney Hertzberg | 2021-12-07 |
| 11195799 | Hybrid readout package for quantum multichip bonding | Dongbing Shao, Eric P. Lewandowski, Nicholas Torleiv Bronn | 2021-12-07 |
| 11088310 | Through-silicon-via fabrication in planar quantum devices | Joshua M. Rubin, Jared Barney Hertzberg, Sami Rosenblatt, Vivekananda P. Adiga, Arvind Kumar | 2021-08-10 |
| 11088311 | Three-dimensional integration for qubits on multiple height crystalline dielectric | Sami Rosenblatt, Rasit Onur Topaloglu | 2021-08-10 |
| 11069849 | Shadow mask sidewall tunnel junction for quantum computing | Sami Rosenblatt | 2021-07-20 |
| 11038093 | Wirebond cross-talk reduction for quantum computing chips | Dongbing Shao | 2021-06-15 |
| 11005022 | Vertical transmon qubit device with microstrip waveguides | Sami Rosenblatt, Rasit Onur Topaloglu | 2021-05-11 |
| 10976671 | Shadow mask area correction for tunnel junctions | Sami Rosenblatt, Bryan D. Trimm | 2021-04-13 |
| 10930987 | Microfabricated air bridges for planar microwave resonator circuits | Vivekananda P. Adiga | 2021-02-23 |
| 10903412 | Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices | Dongbing Shao, Firat Solgun, Jared Barney Hertzberg | 2021-01-26 |