| 11195799 |
Hybrid readout package for quantum multichip bonding |
Dongbing Shao, Eric P. Lewandowski, Markus Brink |
2021-12-07 |
| 11178771 |
Integrating Josephson amplifiers or Josephson mixers into printed circuit boards |
Baleegh Abdo, Oblesh Jinka, Salvatore Bernardo Olivadese |
2021-11-16 |
| 11165010 |
Cold-welded flip chip interconnect structure |
Eric P. Lewandowski, Jae-Woong Nah |
2021-11-02 |
| 11102879 |
Printed circuit board to dielectric layer transition with controlled impedance and reduced and/or mitigated crosstalk for quantum applications |
Salvatore Bernardo Olivadese, Patryk Gumann |
2021-08-24 |
| 11006527 |
Integrating Josephson amplifiers or Josephson mixers into printed circuit boards |
Baleegh Abdo, Oblesh Jinka, Salvatore Bernardo Olivadese |
2021-05-11 |
| 11005574 |
Superconducting interposer for optical transduction of quantum information |
Daniela Florentina Bogorin, Patryk Gumann, Sean Hart, Salvatore Bernardo Olivadese, Jason S. Orcutt |
2021-05-11 |
| 10984335 |
Superconducting interposer for the transmission of quantum information for quantum error correction |
Daniela Florentina Bogorin, Patryk Gumann, Sean Hart, Salvatore Bernardo Olivadese |
2021-04-20 |
| 10891251 |
Signal connector for microwave circuits |
Salvatore Bernardo Olivadese, Patryk Gumann |
2021-01-12 |
