Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164817 | Multi-chip package structures with discrete redistribution layers | Joshua M. Rubin, Kamal K. Sikka, Lawrence A. Clevenger | 2021-11-02 |
| 11133259 | Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network | Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Wiren D. Becker, Xiao Hu Liu | 2021-09-28 |
| 11114410 | Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices | Joshua M. Rubin, Lawrence A. Clevenger | 2021-09-07 |
| 11094637 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Joshua M. Rubin, Lawrence A. Clevenger | 2021-08-17 |
| 11000474 | Microchip substance delivery devices | S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more | 2021-05-11 |
| 10940265 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb | 2021-03-09 |
| 10881788 | Delivery device including reactive material for programmable discrete delivery of a substance | Bing Dang, Gregory M. Fritz, Eric P. Lewandowski, Joana S. B. T. Maria, Bucknell C. Webb | 2021-01-05 |