SW

Steven L. Wright

IBM: 7 patents #710 of 11,638Top 7%
Overall (2021): #14,945 of 548,734Top 3%
7
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11164817 Multi-chip package structures with discrete redistribution layers Joshua M. Rubin, Kamal K. Sikka, Lawrence A. Clevenger 2021-11-02
11133259 Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Wiren D. Becker, Xiao Hu Liu 2021-09-28
11114410 Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices Joshua M. Rubin, Lawrence A. Clevenger 2021-09-07
11094637 Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers Joshua M. Rubin, Lawrence A. Clevenger 2021-08-17
11000474 Microchip substance delivery devices S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more 2021-05-11
10940265 Drug delivery device having a cavity sealed by a pressurized membrane Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb 2021-03-09
10881788 Delivery device including reactive material for programmable discrete delivery of a substance Bing Dang, Gregory M. Fritz, Eric P. Lewandowski, Joana S. B. T. Maria, Bucknell C. Webb 2021-01-05