Steven L. Wright — 7 Patents at IBM

Issued Patents 2021

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11164817	Multi-chip package structures with discrete redistribution layers	Joshua M. Rubin, Kamal K. Sikka, Lawrence A. Clevenger	2021-11-02	$2,126,000
11133259	Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network	Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Wiren D. Becker, Xiao Hu Liu	2021-09-28	$6,479,000
11114410	Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices	Joshua M. Rubin, Lawrence A. Clevenger	2021-09-07	$7,685,000
11094637	Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers	Joshua M. Rubin, Lawrence A. Clevenger	2021-08-17	$3,119,000
11000474	Microchip substance delivery devices	S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria +2 more	2021-05-11	$6,417,000
10940265	Drug delivery device having a cavity sealed by a pressurized membrane	Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb	2021-03-09	$4,710,000
10881788	Delivery device including reactive material for programmable discrete delivery of a substance	Bing Dang, Gregory M. Fritz, Eric P. Lewandowski, Joana S. B. T. Maria, Bucknell C. Webb	2021-01-05	$2,293,000