Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133259 | Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network | Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Steven L. Wright, Xiao Hu Liu | 2021-09-28 |