| 11201138 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management |
Bing Dang, John U. Knickerbocker, Jae-Woong Nah |
2021-12-14 |
| 11158781 |
Permanent wafer handlers with through silicon vias for thermalization and qubit modification |
Jae-Woong Nah, Eric P. Lewandowski, Adinath S. Narasgond |
2021-10-26 |
| 11121005 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang |
2021-09-14 |
| 11094407 |
Electronics miniaturization platform for medication verification and tracking |
John U. Knickerbocker, Bing Dang, Katsuyuki Sakuma, Jeffrey D. Gelorme, Rajeev Narayanan +1 more |
2021-08-17 |
| 11055459 |
Heterogeneous miniaturization platform |
Qianwen Chen, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff |
2021-07-06 |
| 11043301 |
Infrared detectors and thermal tags for real-time activity monitoring |
Jui-Hsin Lai |
2021-06-22 |
| 10940554 |
Planar fabrication of micro-needles |
Jui-Hsin Lai, Chia-Yu Chen, Ko-Tao Lee |
2021-03-09 |
