Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201138 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, John U. Knickerbocker, Jae-Woong Nah | 2021-12-14 |
| 11158781 | Permanent wafer handlers with through silicon vias for thermalization and qubit modification | Jae-Woong Nah, Eric P. Lewandowski, Adinath S. Narasgond | 2021-10-26 |
| 11121005 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang | 2021-09-14 |
| 11094407 | Electronics miniaturization platform for medication verification and tracking | John U. Knickerbocker, Bing Dang, Katsuyuki Sakuma, Jeffrey D. Gelorme, Rajeev Narayanan +1 more | 2021-08-17 |
| 11055459 | Heterogeneous miniaturization platform | Qianwen Chen, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff | 2021-07-06 |
| 11043301 | Infrared detectors and thermal tags for real-time activity monitoring | Jui-Hsin Lai | 2021-06-22 |
| 10940554 | Planar fabrication of micro-needles | Jui-Hsin Lai, Chia-Yu Chen, Ko-Tao Lee | 2021-03-09 |