Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892170 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz | 2021-01-12 |
YP
Yi Pan
Overall (2021): #202,057 of 548,734Top 40%
1
Patents 2021