Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11156409 | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | Hongqing Zhang, Jay A. Bunt, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey A. Zitz | 2021-10-26 |
| 11158562 | Conformal integrated circuit (IC) device package lid | Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz, Sushumna Iruvanti | 2021-10-26 |