Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183446 | X.5 layer substrate | Jaehyun Yeon, Hong Bok We, Kun Fang | 2021-11-23 |
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Chaoqi Zhang, Rajneesh Kumar, Li-Sheng Weng, Darryl Sheldon JESSIE, Jeahyeong Han +2 more | 2021-10-05 |
| 11043740 | Enhanced antenna module with shield layer | Chin-Kwan Kim, Hong Bok We, Jaehyun Yeon | 2021-06-22 |