Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Chaoqi Zhang, Rajneesh Kumar, Li-Sheng Weng, Darryl Sheldon JESSIE, Suhyung Hwang +2 more | 2021-10-05 |