Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Rajneesh Kumar, Li-Sheng Weng, Darryl Sheldon JESSIE, Suhyung Hwang, Jeahyeong Han +2 more | 2021-10-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Rajneesh Kumar, Li-Sheng Weng, Darryl Sheldon JESSIE, Suhyung Hwang, Jeahyeong Han +2 more | 2021-10-05 |