Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189574 | Microelectronic package having electromagnetic interference shielding | Chung-Hao Chen, James C. Matayabas, Jr., Min Keen Tang | 2021-11-30 |
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Chaoqi Zhang, Rajneesh Kumar, Darryl Sheldon JESSIE, Suhyung Hwang, Jeahyeong Han +2 more | 2021-10-05 |
| 10910314 | Conductive coating for a microelectronics package | Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun, Mitul Modi | 2021-02-02 |